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KerfAid advanced
Product Description
KerfAid Advanced has been formulated for use in wafer sawing process. The formula has been developed to effectively remove silicon dust, prevent galvanic corrosion, chipping and cracking, particulates or contamination from occurring on variety of surfaces.
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Features
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KerfAid provides solution to bond pad staining
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Chipping and cracking prevention
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Able to use on a variety of materials like in process compound semiconductor materials include: silicon carbide, gallium arsenide, gallium nitride and more
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Product Type
KA1000/ KA200/KA4000
KA100/KA200/KA400
For more information:
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