KerfAid Original has been formulated for use in wafer sawing process. The formula has been developed to effectively remove silicon dust, prevent galvanic corrosion, chipping and cracking, particulates or contamination from occurring on variety of surfaces.
KerfAid provides solution to bong pad staining
Chipping and cracking prevention
Able to use on a variety of materials like in process compound semiconductor materials include: silicon carbide, gallium arsenide, gallium nitride and more
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